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Intel Charts Course to Trillion-Transistor Chips: 2D Transistor Materials, 3D Packaging Research

Intel released nine research papers at IEDM 2022 that lay the groundwork for future chip designs as the company looks to deliver on its promise of developing processors with over a trillion transistors by 2030.

The research includes new 2D materials for transistors, new 3D packaging technology that narrows the performance and power gap between chiplet and single-die processors to a nearly-imperceptible range, transistors that ‘don’t forget’ when power is removed, and embedded memories that can be stacked directly on top of transistors and store more than one bit per cell, among other innovations.

Intel’s Components Research (CR) Group lays the initial groundwork for the company’s future technologies, but not all of these initiatives will result in products that ship to market. Those that do come to market would typically arrive in five to ten years. 

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